SOLDERS: Database for lead free solders
This database was created as part of the European
collaborative project COST531.
It is a self-consistent thermodynamic database for lead-free solder
materials and substrates and contains critically assessed thermodynamic
parameters for more than 50 binary systems
collected from the literature or provided directly by a
programme of experimental and assessment work as part of the COST
data were supplemented by parameters for ternary systems to provide a
self-consistent thermodynamic database.The database has been tested
using a variety of proprietary software to ensure its portability.
The database covers the following 11 elements
Au, Bi, Cu, In, Ni, Pb, Pd, Sb, Sn, Zn
Data for all 55 binary systems are included within
the database with
the exception of
the Ni-Sb and Pd-Sb systems. Data for these systems will be included in
Please click here
for binary phase diagrams
calculated using the solders database.
Data have also been critically assessed for a
number of ternary systems
Ag-Au-Sb, Ag-Bi-Sn, Ag-Cu-Ni, Ag-Cu-Pb,
Au-In-Sb, Au-In-Sn, Au-Ni-Sn
Data for other ternary systems will be included as
and when they become
Details about the critical assessments and
calculations carried out
using the database have been published as an Atlas of Phase Diagrams for
Lead-Free Soldering by A T Dinsdale, A Watson, A Kroupa, J
Vrestal, A Zemanova and J Vizdal.
The thermodynamic database will be maintained and developed further. In
addition to the
addition of data for the Ni-Sb and Pb-Sb systems, data for further
ternary systems will be assessed
and the scope of the database will be extended to include P.
The final version of the database is now being
commercially for use by the wider scientific community as version 1.0
of the SOLDERS database for the calculation of phase diagrams.
For further information please contact Alan Dinsdale.
The database could be used for a range of
applications such as:
- Understand issues
of contamination of lead free solder through reworking of old solder
- Understand volume
changes associated with solidification and solid state transformation
reactions – tin
- Predict liquidus
and solidus temperatures of candidate solders
- Model formation of
the intermetallics at interface between substrate and the solder
- Model surface
MTDATA version of this database.
NPL research into Electronic
Interconnection and Lead Free Solders