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SOLDERS: Database for lead free solders

This database was created as part of the European collaborative project COST531. It is a self-consistent thermodynamic database for lead-free solder materials and substrates and contains critically assessed thermodynamic parameters for more than 50 binary systems collected from the literature or provided directly by a programme of experimental and assessment work as part of the COST action. These data were supplemented by parameters for ternary systems to provide a self-consistent thermodynamic database.The database has been tested thoroughly using a variety of proprietary software to ensure its portability.

The database covers the following 11 elements

Ag, Au, Bi, Cu, In, Ni, Pb, Pd, Sb, Sn, Zn

Data for all 55 binary systems are included within the database with the exception of the Ni-Sb and Pd-Sb systems. Data for these systems will be included in due course. Please click here for binary phase diagrams calculated using the solders database.

Data have also been critically assessed for a number of ternary systems including:

Ag-Au-Bi, Ag-Au-Sb, Ag-Bi-Sn, Ag-Cu-Ni, Ag-Cu-Pb,

Ag-Cu-Sn, Ag-In-Sn, Ag-Ni-Sn

Au-Bi-Sb, Au-In-Sb, Au-In-Sn, Au-Ni-Sn

Bi-In-Sn, Bi-Sb-Sn, Bi-Sn-Zn

Cu-In-Sn, Cu-Ni-Pb, Cu-Ni-Sn

In-Sb-Sn, In-Sn-Zn

Data for other ternary systems will be included as and when they become available.

Details about the critical assessments and calculations carried out using the database have been published as an Atlas of Phase Diagrams for Lead-Free Soldering by A T Dinsdale, A Watson, A Kroupa, J Vrestal, A Zemanova and J Vizdal. The thermodynamic database will be maintained and developed further. In addition to the addition of data for the Ni-Sb and Pb-Sb systems, data for further ternary systems will be assessed and the scope of the database will be extended to include P.

The final version of the database is now being made available commercially for use by the wider scientific community as version 1.0 of the SOLDERS database for the calculation of phase diagrams. For further information please contact Alan Dinsdale.

The database could be used for a range of applications such as:

  • Understand issues of contamination of lead free solder through reworking of old solder joints
  • Understand volume changes associated with solidification and solid state transformation reactions – tin pest
  • Predict liquidus and solidus temperatures of candidate solders
  • Model formation of the intermetallics at interface between substrate and the solder
  • Model surface tension

Download the MTDATA version of this database.

NPL research into Electronic Interconnection and Lead Free Solders


Updated 31 March 2010