MP0602: Advanced Solder Materials for High
Although lead may no longer be used in the
electrical and electronic materials within Europe, high temperature,
high lead-containing materials
are currently exempt from legislation. This is likely to change and
this COST project, MP0602, is
an opportunity for the European scientific and industrial community to
prepare for this eventuality.
There is currently no "drop-in" alternative to the high temperature
solders (>300 C), high lead
(90% Pb) currently in use. The aim ultimately is to identify a number
of environmentally friendly lead-free solder systems suitable for
high-temperature applications. The Action runs from March 2007
to May 2011.
The main beneficiaries of this project are thought
to be the electonics
industry for advanced
packaging technologies, power circuits (where high levels of
conductivity are required), the automotive industry for under bonnet
applications where high current and low voltages
lead to high temperatures within the engine area and multi-chip
step soldering approach which requires a range of solders with
different melting points.
The scientific programme will be based on a
Different working groups will develop materials property databases
(thermodynamics and kinetics, materials properties, and
process related properties of the solder and joint materials), model
solder beahviour (the
formation of intermetallic compounds at solder/substrate interface, the
development of texture of reaction products in concentration gradients
and of defect structures in vicinity of reaction interface,
competitive nucleation and growth of intermediate phases and the
prediction of corrosion behaviour, deformation processes, failure modes
etc. during fabrication and service),
understand the thermo-mechanical fatigue and durability of interfaces
and intermetallics, and finally to
identify optimum process conditions.
information about MP0602.