The IAG is a committee of representatives from across the industry whose purpose is to guide and monitor the progress of research programmes. Typically there are 3 IAG meetings per year, held at NPL. Widespread representation of the microelectronics industry on the IAG is essential to ensure that the projects address the relevant needs of industry. An industrialist chairs the committee to ensure industry focus is maintained. If you are interested in joining this committee, please contact:
Dr Christopher Hunt National Physical Laboratory Hampton Road Teddington, Middx UK, TW11 0LW |
Tel: +44 20 8943 7027 Fax: +44 20 8614 0428 Email: chris.hunt@npl.co.uk |
This following reports are accessible only by appointed members of the Industrial Advisory Group (IAG) and the DIUS Technical Advisor associated with the specified DIUS project. These documents cover work in progress and the content must not be used for any other purpose other than advice to, and management of, the project team.
Time | Date | Programme | Restricted access |
10:00 - 15:00 | 30/09/2008 | Lead-free Solder: B1 | Enter Password |
ReUSE | Enter Password | ||
10:00 - 15:00 | 28/02/2008 | Lead-free Solder: B1 | Enter Password |
10:00 - 15:00 | 11/09/2007 | Lead-free Solder: B1 | Enter Password |
10:30 - 14:30 | 11/07/2007 | Conductive adhesives: B4 | Enter Password |
10:00 - 15:00 | 13/03/2007 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:30 - 15:00 | 08/03/2007 | Lead-free Solder | Enter Password |
10:30 - 14:00 | 24/01/2007 | Conductive adhesives: B4 | Enter Password |
10:00 - 15:00 | 21/09/2006 | Lead-free Solder | Enter Password |
10:30 - 15:00 | 19/09/2006 | Conductive adhesives: B4 | Enter Password |
10:00 - 15:00 | 24/05/2006 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:30 - 15:00 | 21/03/2006 | Conductive adhesives: B4 | Enter Password |
10:30 - 15:00 | 01/03/2006 | Lead-free Solder B1 | Enter Password |
10:30 - 15:00 | 07/12/2005 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 15:00 | 01/12/2005 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 14:30 | 03/11/2005 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:00 - 15:00 | 05/07/2005 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:30 - 15:00 | 30/06/2005 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 14:30 | 17/05/2005 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:30 - 15:00 | 09/03/2005 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:30 - 15:00 | 09/02/2005 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 12:15 | 09/12/2004 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:00 - 14:00 | 02/11/2004 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 14:00 | 05/10/2004 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 15:00 | 29/06/2004 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 12:15 | 21/05/2004 | Conformal Coatings in Electronic Assemblies: G5 | Enter Password |
10:00 - 14:00 | 29/04/2004 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 15:00 | 12/02/2004 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 14:00 | 27/11/2003 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 14:00 | 16/10/2003 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 14:00 | 20/05/2003 | LEAD-free, SIR: MPP 5.2, 5.4 | Enter Password |
10:00 - 14:00 | 08/05/2003 | Conductive adhesives: MPP 5.6 | Enter Password |
10:00 - 14:00 | 03/12/2002 | MPP | Enter Password |
10:00 - 13:00 | 04/09/2002 | MPI | Enter Password |
10:00 - 12:50 | 16/05/2002 | MPI | Enter Password |
10:00 - 12:50 | 28/02/2002 | MPM7 | Enter Password |
10:00 - 14:05 | 30/10/2001 | MPM7 | Enter Password |
10:00 - 15:06 | 07/06/2001 | MPM7 | Enter Password |
10:00 - 14:25 | 13/02/2001 | MPM7 | Enter Password |
10:00 - 13:00 | 05/10/2000 | MPM7 | Enter Password |
10:00 - 15:30 | 07/06/2000 | MPM7 | Enter Password |
10:00 - 14:00 | 27/01/2000 | MPM7 | Enter Password |
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